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Our
Micromanufacturing Model >>
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BMC provides the following microtechnology services:
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- Process Development for
Packaging & Assembly
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- Precision Robotics &
Automation
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- Testing and Evaluation
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- Pilot & Small Batch
Production
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- User Training
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- Microtechnology
Incubation
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Modular Packaging Platforms
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BMC’s modular packaging
platforms for microsystems are based on a set
of expandable, replaceable, and/or reconfigurable process modules that
include laser solder reflow, die pick and place, die attach, precision
positioning, visual inspection, fiber alignment and attachment.
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Micromanufacturing Challenges
>>
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High Cost of Commercial
Microsystems
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It is widely recognized that packaging, assembly
and testing typically account for around 85% of the cost of commercial microsystems. Yet, most of the R&D effort
invested in Microsystems is presently directed at fabrication
technologies. The high cost of Microsystems is also due to the use of
customized packaging solutions that cannot be reused for different
products.
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The Lack of Readily Available
Processes & Standards
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Back-end packaging processes
have not received much attention in the R&D community. Microsystems
commercialization is therefore limited by the lack of readily available
processes and standards for basic operations such as joining, sealing,
assembly, interconnects and quality assurance.
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Small Pool of Vendors
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There are too few vendors who
can provide micropackaging and microassembly services to young start-up companies,
where the company founders/inventors are typically more absorbed in
concept and product development than manufacturing process development
and system integration.
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Generic and Modular Packaging Tools &
Platforms
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BMC addresses current micromanufacturing problems through the development
of generic and modular packaging tools and platforms, and their
deployment into a system prototyping and low volume pilot production
facility.
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Integrated Microsystems
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The cost-effective manufacturing
of integrated microsystems is a major
objective, and the design of modular system architectures a key element
of our technical approach.
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Heterogeneity
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Our approach also recognizes
that heterogeneity, i.e. the assembly of microparts
fabricated from different materials using different processes, can
improve yields and reduce costs by reducing the complexity involved in
fabricating complex monolithic systems on a single substrate.
[to TOP]
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Photo courtesy of Indian Head Division NAVSEA
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Microsystems Packaging >>
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BMC’s core technologies
target microsystems packaging processes and
systems level integration, with an emphasis on microfluidics,microoptics and microsensors.
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