State of the Art Facilities
BMC houses a state-of-the art, 3,000 square-foot clean room, equipped with back-end microassembly and packaging tools.
Robotic Assembly & Manipulation
- Reconfigurable course and fine assembly.
- Motorized cameras.
- Advanced micropositioning systems.
Testing & Metrology
- Optical leak testing.
- Gross leak testing.
- 3D MEMS profiler and motion analyzer.
- Advanced image analysis systems.
- Pull testing.
- Wafer probing.
Bonding: Welding & Soldering
- Laser soldering.
- Hermetic sealing with seam sealing and projection welding.
- Wire bonding
BMC's Facilities Include
Robotworld system from Motoman, model RW-161, using three end effectors and additional hardware, with a total of 15 motorized degrees of freedom.
Optical Leak Tester
High resolution optical leak detection system from Norcom, Model 2020
High Precision MEMS Metrology
High resolution surface profilometer with dynamic motion measurement capabilities from Veeco, model Wyko NT 1100
Large working distance microscope from Olympus, model BH2
Bond Test System,Wire & Die Shear
Mechanical reliability testing from Mini-Instron ™ 5848
Probe station from Suss Microtech, Model PSM -6 with four probes.
High power (60 W) laser, from Coherent, Model Quattro-FAP
Parallel Seam Welder
Unitek - Benchmark Parallel seam welder with Generation 2 enclosure.
Clean Room Facilities
BMC's 3,000 square-foot clean room, is equipped for automated MEMS packaging.